China Wholesale Circuit Board Micro Switch Manufacturers - DK4-BZ-002 – Tongda


China Wholesale Circuit Board Micro Switch Manufacturers - DK4-BZ-002 – Tongda

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China Wholesale Circuit Board Micro Switch Manufacturers - DK4-BZ-002 – Tongda Detail:

DK4-BZ-002-

(The defining characteristics of operation)

(Operating Parameter)

(Abbreviation)

(Units)

 pdd

(Free Position)

FP

mm

(Operating Position)

OP

mm

(Releasing Position)

RP

mm

(Total travel Position)

TTP

mm

(Operating Force)

OF

N

(Releasing Force)

RF

N

(Total travel Force)

TTF

N

(Pre Travel)

PT

mm

(Over Travel)

OT

mm

(Movement Differential)

MD

mm

Switch technical Characteristics

(ITEM)

(technical parameter)

(Value)

1

(Electrical Rating) 10(1.5)A 250VAC

2

(Contact  Resistance) ≤50mΩ( Initial value)

3

(Insulation Resistance) ≥100MΩ(500VDC)

4

(Dielectric Voltage) (between non-connected terminals) 500V/0.5mA/60S
(between terminals and the metal frame) 1500V/0.5mA/60S

5

(Electrical Life) ≥10000 cycles

6

(Mechanical Life) ≥3000000 cycles

7

(Operating Temperature) -25~105℃

8

(Operating Frequency) (electrical):15 cycles(Mechanical):60 cycles

9

(Vibration Proof)

(Vibration Frequency):10~55HZ;

(Amplitude):1.5mm;

(Three directions):1H

10

(Solder Ability): (More than 80% of immersed part shall be covered with solder) (Soldering Temperature):235±5℃(Immersing Time):2~3S

11

(Solder Heat Resistance) (Dip Soldering):260±5℃ 5±1S(Manual Soldering):300±5℃ 2~3S

12

(Safety Approvals)

UL、CSA、TUV、ENEC

13

(Test Conditions) (Ambient Temperature):20±5℃(Relative Humidity):65±5%RH

(Air Pressure):86~106KPa

Analysis of the overall operation flow of the micro switch

The overall operation process of the micro switch is detailed:
①Operating pressure OF: It is added to the button or the actuator to make the switch produce the maximum force required for forward action (connecting or disconnecting the circuit).
②Reverse operating force RF: The minimum force that the button or actuator can bear when the switch is reversed (disconnected or connected to the circuit).
③Contact pressure TF: The pressure of the static contact point when the button or actuator part is in the free position, or the pressure of the dynamic contact point when the button actuator part is in the limit position.
④Free position FP: The position from the highest point of the button or actuator to the base line of the switch mounting hole when the switch is in the normal state and is not subject to external force.
⑤Operation position OP: When the switch button or actuator component is in a positive action, the position from the highest point of the button or actuator component to the base line of the switch mounting hole.
⑥Restore position RP: When the switch button or actuator component is in reverse action, the position from the highest point of the button or actuator component to the base line of the switch mounting hole.
⑦Total movement TTP: The maximum position that the switch button or actuator component can allow to move when it is working.
⑧ Action stroke PT: The maximum distance from the free position of the switch button or actuator to the positive action position.
⑨ Overrun travel OT: The switch button or actuator component continues to move downward from the positive action position, and the distance to the limit position that does not end or damage the mechanical performance of the switch, usually takes the minimum value.


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